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成兰仙

发布者:张文元发布时间:2020-04-23浏览次数:827



成兰仙

副教授

硕士生导师

性别

联系方式

18620880721

政治面貌

中共党员

邮箱

chenglx@scau.edu.cn

办公地点:

信息楼406

个人简介:

成兰仙,女,博士,高级工程师,1981年生,浙江义乌人。2003年毕业于湖南大学电子科学与技术专业,同年保送在本校电力电子与电力传动专业攻读硕士研究生,2006年获得硕士学位。2016年于华南理工大学获得微电子学与固体电子学博士学位。曾多年从事开关电源及其逆变技术研究,在电力电子领域有一定的造诣。从事研发期间,发表核心论文两篇,负责的项目获得中国人民解放军总参谋部授予的“军队科技进步三等奖”。同时,在新型封装材料及其可靠性方面积累了较多的科研成果,累计发表SCI检索论文十余篇。


工作经历:

2006/06—2014/05   广州无线电集团海华电子          研发中心项目经理
2016/07—
至今       华南农业大学电子工程学院       副教授


教育经历:

1999/09--2003/06    湖南大学    电子科学与技术                 本科
2003/09--2006/06    
湖南大学    电力电子与电力传动          硕士研究生

2011/09--2016/04  
华南理工大学  微电子学与固体电子学    博士研究生


获奖荣誉:

201312月获得中国人民解放军总参谋部授予的 “军队科技进步三等奖”。


研究领域:

微电子学与固体电子学(先进微电子封装材料及其工艺)、电力电子与电力传动(电力传动及其控制系统)


科研项目:

主持国家自然科学基金项目“低温活性焊料SnAgTiSiC的表面润湿和界面结合机理研究”,项目批准号:61804057,项目直接经费:24万元。


发表论文:

1. L. X. Cheng, G. Y. Li, Z. L. Li, Z. Z. Wu and B. Zhou. Effects of Titanium on Active Bonding between Sn3.5Ag4Ti(Ce,Ga) Alloy Filler and Alumina. Journal of materials science-materials in electronics. Vol.26, No.8, 2015, (SCI, 3).
2.
L. X. Cheng, G. Y. Li, X. Q. Wang, Z. L. Li and Z. Z. Wu. A Novel Low Temperature Active Bonding of Si/Si with Sn3.5Ag4Ti(Ce,Ga) Alloy Filler. Materials letters. Vol.165, 2016, (SCI, 2).
3.
L. X. Cheng, G. Y. Li, X. Q. Wang, Z. L. Li and Z. Z. Wu. Influence of Active Element Ti on Interfacial Reaction and Soldering Strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate. Materials science and engineering A. Vol. 658, 2016, (SCI, 2).
4.
L. X. Cheng, M. R. Liu, G. Y. Li, X. Q. Wang and B. H. Yan. Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/SiO2 joints soldered using Sn3.5Ag4Ti(Ce, Ga) alloy filler. Materials science and engineering A. Vol. 680, 2017, (SCI, 2).
5.
成兰仙,李国元,焊料Sn3.5Ag4Ti(Ce,Ga)SiO2基板低温活性焊接机理的研究. 华南理工大学学报.Vol.44, No.9, 2016, (EI)
6. Z. L. Li, G. Y. Li,
L. X. Cheng, J. H. Huang. Effect of Nano-TiO2 Addition on Microstructural Evolution of Small Solder Joints. Journal of materials science-materials in electronics. Vol.27, 2016, (SCI, 3).
7. Z. L. Li, G. Y. Li, B. Li,
L. X. Cheng, J. H. Huang and Y. Tang. Size Effect on IMC Growth in Micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 Solder Joints in Reflow Process. Journal of Alloys and Compounds. Vol.685, 2016, (SCI, 2).
8. Z. L. Li,
L. X. Cheng, G. Y. Li, J. H. Huang and Y. Tang. Effects of joint size and isothermal aging on interfacial IMC growth in Sn3.0Ag0.5Cu-0.1TiO2 solder joints. Journal of Alloys and Compounds, Vol. 697, 2017, (SCI, 2).
9. Jiang Xia, Guoyuan Li, Bin Li, and
Lanxian Cheng. Optimal Design for Vibration Reliability of Package-on-Package Assembly Using FEA and Taguchi Method.  IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 6, No.10, 2016, (SCI, 3)
10. Jiang Xia, GuoYuan Li, Bin Zhou, and
 LanXian Cheng. PoP Assembly Reliability Test and Assessment Under Random Vibration Loading. The17th International conference on electronic packaging Technology (ICEPT 2016), (EI)
11.
成兰仙,权运良,大功率三相PWM整流器的研究与实现. 电力电子技术. Vol.47, No.8, 2013. (中文核心)
12. JiangXia, LinYang, QunxingLiu, QiPeng,
 LanXian Cheng, GuoYuanLi. Comparison of Fatigue Life Prediction Methods for Solder Joints Under Random Vibration Loading, Microelectronics Reliability, Vol. 95, 2019, (SCI, 4)
13. Xia Jiang,
Cheng LanXian, Li GuoYuan, Li Bin. Reliability Study of Package-on-Package Stacking Assembly Under Vibration Loading. Microelectronics Reliability, Vol. 78, 2017 (SCI, 4)
14. JiangXia, GuoYuanLi, BinLi,
LanXianCheng, BinZhou. Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading. Microelectronics Reliability, Vol. 71, 2017 (SCI, 4)

15.L. X. Cheng, B. H. Yan and Y Liu. Effects of active adsorption on thermodynamic equilibrium of solid-liquid interface. IOP Conference Series: Materials Science and Engineering, Volume 770, 8th Global Conference on Materials Science and Engineering (CMSE2019), 12-15 November 2019, Sanya, China. (EI)

16. Guanting Cen, Honglang Deng, Lanxian Cheng*, ,Shaolin Zhou, Shaowei Liao. Terahertz (THz) Metasurface Switch by Phase Change Medium. 2019 IEEE MTT-S International Wireless Symposium (IWS 2019). 6th IEEE MTT-S International Wireless Symposium(IWS) part of China Microwave week, May 19-22,2019. Guangzhou, China. (EI)


教学活动:

主讲《DSP原理与应用》、《DSP原理与应用实验》、《单片机原理与应用》、《数字电子技术》、《模拟电子技术实验》、《大学物理实验》、《单片机系统综合设计》和《印制电路板设计》等课程。


指导学生:

指导了三十余位学生的毕业设计,并指导学生参与创新创业训练项目。